SDATMStandard microSDTMMemory Card Connector
ST4 Series With Card Popping Out Countermeasure
Has Been Developed
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ST4 series connector for microSDTMmemory card has been developed due to the trends for smaller, lighter and complex mobile phones with audio functions, etc.
This connector is compact and adopts easy handling push-push structure and has features to prevent causes of data corruption by dropping with countermeasures for electrical discontinuity and popping out of card.
SDATM: SD Card AssociationTM
microSDTMis a trademark of SDATM
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:: Features
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1
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With a countermeasure to prevent the card from popping out. |
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Connector for micro SDTMmemory card, standardized by the SDATM |
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Compact, low profile designed reverse mounting type with1.85mm mounting height,
16.5mm depth (18.8mm with memory card) and 15.5mm width (including H/D) . |
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Adopts push-push structure for minimized mounting space. |
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With half lock structure to prevent falling out of card after second action. |
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Compatible to automatic mounting (compliant to second reflow). |
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With structure to prevent reverse card insertion . |
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With D-S/W for card detection. |
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Pb-free products (RoHS directive) . |
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1.0mm push stroke and 3.0mm card eject length. |
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Shield characteristic secured by the 4 ground connection points. |
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:: Applicable market
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Mobile phones, DSC, PDA/HPC, PC, navigations and other portable devices
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:: General specifications |
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Items |
Specification and performance |
| 1 |
No. of contacts |
8pos. for signal and 2pos. for D-S/W |
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Rated current |
0.5A max. per terminal |
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Rated voltage |
10V |
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Contact resistance |
100 millohms or less |
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Insulation resistance |
1,000 megaohoms or more. |
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Operating temperature |
-25 Cel to +85 Cel |
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Durability |
10,000 times |
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Dielectric withstanding voltage |
AC500Vr.m.s per minute |
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:: Materials / Finishes |
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Components |
Materials |
Finishes |
| 1 |
Contact
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Copper alloy |
Contact area: 0.5u min. Au plating over Ni
Terminal area: Au flash over Ni
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| 2 |
Card insertion/removal detection area |
Copper alloy |
Contact area: 0.5u min. Au plating over Ni
Terminal area: Au flash plating over Ni
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| 3 |
Housing |
Glass filled LCP |
none (UL94V-0) |
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Eject bar |
Stainless steel |
none |
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Cover frame |
Stainless steel |
Connection area: Au flash plating over Ni |
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Spring |
SWPB |
Ni plating |
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