Space Saving Product, Designed for Small Devices
Small Memory Card micro SDTM and
GSM 11.11 Plug
in SIM Card
Combo Connector ST5 Series Has Been Developed
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Recently, mobile phones equipping GSM 11.11 Standard Plug-in SIM Card and removable small memory cards are increasing due to the diffusion of the 3G models and hybrid cell phones with audio player, one-segment TV and GPS functions.
To meet these demands, this combo connector compatible with GSM 11.11 Plug in SIM Card and SDA standardized micro SDTM Card, now having a high share in the small memory market, has been developed.
The minimized mounting space makes it ideal for freer mounting and designing smaller devices. With a user-friendly structure by succeeding the already developed Push-Push structure
*micro SDTM: Trademark of SD ATM (SD Card Association)
*Combo connector: A connector that can have two kinds of cards inserted at the same time.
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:: Features
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(General)
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1
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Combo type connector with a microSD TM card connector that adopts countermeasure for card falling out proven by ST* Series and a minimized GSM 11.11 compliant Plug in SIM card connector that adopts slide structure for card handling. |
2
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Balanced EMI countermeasure by the 4 hold-down points
(4 portion of a cover frame mounted on a board by soldering) |
3
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Slim design with 2.8mm height, 17.35mm depth (depth including card: 19.2mm x 26mm) and 19.2mm width |
4
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Supply for automatic mounting in embossed tape (Compatible to second reflow) |
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(micro SD TM side) |
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1mm push stroke and 3.3mm card eject length |
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With card half lock structure |
| 7 |
Countermeasure to prevent the card from popping out. |
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With card insertion detection structure (D-S/W) Normally Open |
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:: Applicable market
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Mobile phone, PDA/ HPC, PC, etc.
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:: General specifications |
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Items |
Specification and performance |
| 1 |
No. of contacts |
14pos. + 2 pos. (D-SW) |
| 2 |
Rated current |
0.5 A |
| 3 |
Insulation resistance |
1,000 megaohoms or more. |
4 |
Contact resistance |
100 millohms or less |
5 |
Dielectric withstanding voltage |
AC500V r.m.s. per minute |
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Operating temperature |
-25Cel to +85Cel |
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Durability |
5,000 times/ 10,000 times |
| 8 |
Storage Temperature |
-10Cel to +60Cel |
| 9 |
Temperature Rise |
30 Deg. C rise max |
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:: Materials / Finishes |
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Receptacle
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Components |
Materials |
Finishes |
| 1 |
Signal contact
(microSD TM , SIM in common) |
Copper alloy |
contact area / 0.5um min. Au plating over Ni
terminal area / Au flash plating over Ni
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| 2 |
Housing |
Synthetic resin |
None (UL94V-0) |
| 3 |
Cover frame |
Stainless steel |
Au plating over Ni (Connection area only) |
| 4 |
Eject bar |
Synthetic resin |
None (UL94V-0) |
| 5 |
Spring |
Stainless steel |
None |
| 6 |
D-SW contact |
Compliant with signal contact |
| 7 |
Card lock |
Stainless steel |
None |
| 8 |
Cam follower |
Stainless steel |
None |
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