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TOP > What's new
  What's new
(2009.10.20)

Volume Reduced By 40 Percent
(Compared to Our Previous Product)
Smallest-in-Class Size in the Industry, Compact, microSDTM Card Connector
"ST1 Shrink Type" Has Been Developed

ST1 series Shrink Type connector

 

 

 

 
Mobile phones are evolving with the inclusion of functions like cameras, audio players, one segment TV and various other applications such as GPS in addition to the original telephone function.
Moreover, devices incorporating both phone and computer functions such as smart phones are now increasingly common.
Data and software for these devices are mainly exchanged and distributed with small memory cards, and it is estimated that currently more than 60% of manufactured devices have slots for small memory cards.

JAE has already developed and expanded the "ST* Series" connectors for the microSDTM card, which holds a major share of the small memory card market. However in order to meet the market demand for an even lighter, slimmer, lower profile, and smaller connector, the ST1 Shrink Type has now been developed. This hinge-type connector maintains high mechanical and electrical performance but with a 40% reduction in volume and a 20% reduction in mounting area from the previous product, and an overall smallest-in-class size in the industry.

*microSDTM: Trademark of SDATM (SD Card Association)

:: Features
 

  • Push-slide structure connector for the microSDTM card standardized by the SDA.
  • Balanced EMI control through 4 hold-down grounding points.
  • Slim design with 1.4mm height, 15.5mm depth, 11.9mm width. 40% reduced volume and 20% reduced mounting area, compared to our previous product.
  • Supplied in embossed tape for automatic mounting.
  • Compatible with second reflow due to reduced weight (after surface solder reflow, back surface reflow also possible).
  • Available with and without card insertion detection structure (D-SW), normally open. Part number: ST1-F (with insertion detection structure), ST1-G (without insertion detection structure).
  • Locking structure prevents falling off of cover when dropped.

:: Applicable market
 

Mobile phone, PDA, PC, etc.
 

:: General specifications
 
  1. No. of Contacts: 8pos. + 2 pos. (only for D-SW type)
  2. Rated Current: 0.5 A
  3. Insulation Resistance: 1,000 M ohm min.
  4. Contact Resistance: 100 m ohm max.
  5. Dielectric Withstanding Voltage: AC500 Vr.m.s. per minute
  6. Operating Temperature: -25 Deg. C to +85 Deg. C
  7. Durability: 10,000 times
  8. Storage Temperature: -10 Deg. C to +60 Deg. C
  9. Temperature Rise: 30 Deg. C rise max.

:: Materials and Finishes
 
Component Material/ Finish

Signal Contact

Copper alloy / Contact area 0.5µm min. Au plating over Ni
Terminal area Au flash plating over Ni

Housing

Synthetic resin / None (UL94V-0)

Cover

Stainless steel / None, terminal conforms with contact

D-SW Contact

Conforms with signal contact

 

Link to Series Information
 

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